Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 125°C (TJ)
Graphics Acceleration:
No
Co-Processors/DSP:
Multimedia; NEON™ MPE
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14x14)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Number of Cores/Bus Width:
2, 1 Core, 64-Bit
Additional Interfaces:
CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART