ZSSC3230BI1DES

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ZSSC3230BI1DES

DICE (WAFER SAWN) - WAFFLE PACK

Model:

ZSSC3230BI1DES

Manufacturer:

Renesas Electronics Corporation

Category:

Integrated Circuits (ICs) > Interface > Sensor and Detector Interfaces

Description:

DICE (WAFER SAWN) - WAFFLE PACK

RoHS:

YES

：

ZSSC3230BI1DES

ZSSC3230BI1DESSpecifications

Part Status :

Active

Mounting Type :

Surface Mount

Operating Temperature :

-40°C ~ 125°C (TA)

Package / Case :

Die

Supplier Device Package :

Die

Current - Supply :

1.1 mA

Input Type :

Analog, tal

Type :

Capacitive Sensor

Output Type :

I2C, Serial

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